Design of Transport Layer Assisted Routing for Thermal-Aware 3D Network-on-Chip

The thermal challenge of 3D Network-on-Chip (NoC) is severer than 2D NoC. To ensure thermal safety and avoid huge performance back-off from temperature constraint, Runtime Thermal Management (RTM) is required. However the regulation of temperature requires throttling of the nearoverheated router, which makes the topology become NonStationary Irregular Mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) framework, the Downward-Lateral Deterministic Routing (DLDR) algorithm, and the corresponding architecture. Based on the result of experiment and implementation, the proposed routing scheme can improve throughput by 70% with 9.1% hardware overhead.